Specification
Form Factor M.2 2280
Interface PCIe Gen3x4
Performance 1TB —sequential read up to 3300MB/s, write up to 3000MB/s
Operating Temperature 0°C to 70°C (32°F to 158°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Dimension (L x W x H) 80 mm x 22 mm x 2.25 mm / 3.15” x 0.87” x 0.09”
Weight 9g
Warranty 5 year limited warranty
Shock Resistant 1500 G, duration 0.5ms, Half Sine Wave
Vibration Resistant 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z)
TBW 1 TB: 500 TB, 512 GB: 250 TB,, 256 GB: 125 TB
DWPD 1 TB: 0.44, 512 GB: 0.44, 256 GB: 0.44
NAND flash 3D TLC
MTBF 1,500,000 Hours
Specification
Form Factor M.2 2280
Interface PCIe Gen3x4
Performance 256GB —sequential read up to 3300MB/s, write up to 1300MB/s
Operating Temperature 0°C to 70°C (32°F to 158°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Dimension (L x W x H) 80 mm x 22 mm x 2.25 mm / 3.15” x 0.87” x 0.09”
Weight 9g
Warranty 5 year limited warranty
Shock Resistant 1500 G, duration 0.5ms, Half Sine Wave
Vibration Resistant 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z)
TBW 1 TB: 500 TB, 512 GB: 250 TB,, 256 GB: 125 TB
DWPD 1 TB: 0.44, 512 GB: 0.44, 256 GB: 0.44
NAND flash 3D TLC
MTBF 1,500,000 Hours
Specification
Form Factor M.2 2280
Interface PCIe Gen3x4
Performance 2TB —sequential read up to 3300MB/s, write up to 3000MB/s
Operating Temperature 0°C to 70°C (32°F to 158°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Dimension (L x W x H) 80 mm x 22 mm x 2.25 mm / 3.15” x 0.87” x 0.09”
Weight 9g
Warranty 5 year limited warranty
Shock Resistant 1500 G, duration 0.5ms, Half Sine Wave
Vibration Resistant 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z)
TBW 1 TB: 500 TB, 512 GB: 250 TB,, 256 GB: 125 TB
DWPD 1 TB: 0.44, 512 GB: 0.44, 256 GB: 0.44
NAND flash 3D TLC
MTBF 1,500,000 Hours
Specification
Form Factor M.2 2280
Interface PCIe Gen3x4
Performance 512GB —sequential read up to 3300MB/s, write up to 2400MB/s
Operating Temperature 0°C to 70°C (32°F to 158°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Dimension (L x W x H) 80 mm x 22 mm x 2.25 mm / 3.15” x 0.87” x 0.09”
Weight 9g
Warranty 5 year limited warranty
Shock Resistant 1500 G, duration 0.5ms, Half Sine Wave
Vibration Resistant 10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z)
TBW 1 TB: 500 TB, 512 GB: 250 TB,, 256 GB: 125 TB
DWPD 1 TB: 0.44, 512 GB: 0.44, 256 GB: 0.44
NAND flash 3D TLC
MTBF 1,500,000 Hours
Specification
Capacity 16GB Kit (8GB x 2) Ram
Interface 288Pin
Performance 2666Mbps - 3200Mbps
3866Mbps - 4000Mbps (Overclock Speed)
Operating Temperature 0°C to 85°C (Surface)
Storage Temperature -55°C to 100°C
Dimension 140 mm x 43.3mm x 7.9 mm (L x W x H)
Warranty Limited lifetime warranty
Memory Type DDR4
Standard JEDEC
Overclock Standard：XMP 2.0 CAS Latency
CL19~CL22Overclock CAS Latency：CL 18-20-20-39 / CL 18-22-22-42
Voltage 1.2V
Overclock Voltage：1.4V
Application Gaming / Content Creating
Specification
Capacity 16GB
Interface 288PIN
Speed 4800MHz (XMP 3.0)
Operating Temperature 0°C to 85°C (Surface)
Storage Temperature -55°C to 100°C
Dimension (L x W x H) L140 x W43.25 x H7.9mm (with heat spreader)
Memory Type DDR5
Standard JEDEC 79-5/XMP 3.0
CAS Latency CL38-38-38-74(XMP 3.0)
Voltage 1.25V (XMP 3.0)
Application Gaming / Creating
Specification
Capacity 16GB
Interface 288PIN
Speed 4800MHz (XMP 3.0)
Operating Temperature 0°C to 85°C (Surface)
Storage Temperature -55°C to 100°C
Dimension (L x W x H) L140 x W43.25 x H7.9mm (with heat spreader)
Memory Type DDR5
Standard JEDEC 79-5/XMP 3.0
CAS Latency CL38-38-38-74(XMP 3.0)
Voltage 1.25V (XMP 3.0)
Application Gaming / Creating
